Principal Package Architect
Astera Labs · San Jose, California, United States
Posted about 2 months ago · $185,000 to $240,000
or apply directly on Astera Labs's site. We never take the application ourselves.
Is this posting real?
- This role has been open
- 54 days Astera Labs's roles stay open a median of 55 days
- Reposted
- No
- Salary listed
- Yes 43% of Astera Labs's roles list one
- Ghost-job risk at Astera Labs
- high 133 stale, 8 reposted of 160 open
- Hiring momentum
- 218 roles opened in the last 90 days ↑ up vs. the prior 90 days
- Last confirmed on the employer's board
- 2026-09-27
Measured from postings appearing on and disappearing from Astera Labs's own greenhouse board since 2026-08-03. Full hiring picture for Astera Labs.
About this role
The Principal Photonics Package Architect at Astera Labs will focus on defining and driving the package architecture for next-generation photonics products aimed at enhancing AI infrastructure. This role involves aligning electrical, thermal, and mechanical design requirements, managing thermal performance targets, and leading package-level design reviews while collaborating with various teams to ensure robust implementation and adherence to specifications.
- benefits
- 1/5
- freshness
- 1/5
- career value
- 4/5
- role clarity
- 5/5
- pay transparency
- 5/5
Scored from the posting itself — how clearly the role is described, how much it says about pay and benefits, and how recently it was listed. Not a judgement of Astera Labs as an employer.
What you need
- B.S., M.S., or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related field
- 10+ years of experience in semiconductor or photonics package development, package design, or package integration
- Strong understanding of package architecture tradeoffs across electrical, optical, thermal, mechanical, and manufacturability considerations
- Experience working across chip, board, and system-level design electrical and optical interfaces in complex product development environments
- Experience with package EDA tools and electrical simulation tools, including Cadence APD+ and Ansys HFSS
- Experience with advanced packaging design, including 2.5D and 3D package architectures
Nice to have
- Experience with industry-standard optical interfaces and interconnect technologies relevant to package design
- Experience with advanced photonics packaging technologies for data center interconnects
- Experience supporting package bring-up and correlating design assumptions with validation results
- Experience supporting cross-functional design closure with silicon, photonics, board, validation, test, and reliability teams
- Knowledge of package design for NPO or CPO products
What you get
- Salary range is $185,000 to $240,000 depending on experience, level, and business need
- This role may be eligible for discretionary bonus, incentives and benefits
Worth weighing
- On-site role in San Jose, CA
- High-impact senior individual contributor role may involve significant responsibility and pressure
- No specific mention of work-life balance or remote work options
Summarised from Astera Labs's posting. Read the full original.
Listed by Astera Labs on their greenhouse job board, last confirmed open on 2026-09-27. PitchMeAI is not the employer.
More roles at Astera Labs
- Senior Principal ASIC Design EngineerGermany (Onsite)
- Senior Program Manager, HR OperationsSan Jose, California, United States
- Distinguished ASIC Design EngineerGermany (Onsite)
- Product Technical Chip Lead, Senior DirectorSan Jose, California, United States
- Senior Principal Engineer PDSingapore, Singapore
- Principal Signal and Power Integrity EngineerSan Jose, CA
- Senior/Staff System Validation EngineerHaifa District, Israel
- Senior/Staff Electronics Engineer - Board ValidationSan Jose, California, United States