4 days ago
元件暨品質可靠度工程師
Winbond
On Site
Full Time
NT$0
Taichung City, Taichung City, Taiwan
Job Overview
Job Title元件暨品質可靠度工程師
Job TypeFull Time
CategoryCommerce
Experience5 Years
DegreeMaster
Offered SalaryNT$0
LocationTaichung City, Taichung City, Taiwan
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Job Description
職位簡述
Winbond 正在尋找一位經驗豐富的元件暨品質可靠度工程師，負責晶圓級可靠度測試、實驗室管理、元件驗證與異常分析追蹤。此職位需具備半導體元件與產品可靠度知識，並能有效溝通協調，支援客戶稽核。
工作內容
- Wafer level可靠度測試(TDDB/HCI/NBTI/EM/SM)程式撰寫
- 可靠度實驗室之建立/維護/管理
- 元件可靠度驗證與測試結果的問題紀錄、分析與追蹤
- 可靠度測試報告撰寫、修訂與維護
- 與外部溝通協調(驗證時程預排、測試周邊規劃等等)
- 異常產品事件(MRB)處理/製程變動管理(PCRB)與系統改善
- 支援客戶稽核報告與資料整理
- 教育課程製作與維護
資格條件
- 學歷要求: 大學
- 科系要求: 電機電子工程相關
- 相關經驗: 4年以上
- 語言能力: 英文 中級
- 管理責任: 無
- 輪班需求: 無
- 出差需求: 未定 (需配合出差竹北廠區，性質為短期出差)
- 外派需求: 無
其他條件
- 具備元件測試程式、Wafer level可靠度程式撰寫四年以上工作經驗。
- 有TSV、Interposer、Hybrid bond等先進封裝技術之元件測試經驗者尤佳。
- 需具備半導體元件與產品可靠度知識，熱心溝通且樂於挑戰可靠度疑難雜症者。
- 具問題分析、溝通協調能力者。
Key skills/competency
- Wafer-level testing
- Reliability engineering
- Test program development
- Failure analysis
- Semiconductor devices
- Quality assurance
- Advanced packaging
- TDDB/HCI/NBTI/EM/SM
- Problem solving
- Laboratory management
How to Get Hired at Winbond
- Research Winbond's culture: Study their mission, values, recent news, and employee testimonials on LinkedIn and Glassdoor.
- Tailor your resume strategically: Customize your application to highlight expertise in wafer-level testing and semiconductor reliability engineering at Winbond.
- Showcase advanced packaging experience: Emphasize any experience with TSV, Interposer, or Hybrid bond technologies relevant to Winbond's innovations.
- Prepare for technical reliability questions: Be ready to discuss semiconductor device reliability knowledge and various test methodologies like TDDB, HCI, NBTI, EM, and SM.
- Demonstrate problem-solving and communication: Practice articulating how you've analyzed complex issues and collaborated effectively with cross-functional teams in previous roles at Winbond interviews.
Frequently Asked Questions
Find answers to common questions about this job opportunity
01What specific reliability tests are performed by a Component and Quality Reliability Engineer at Winbond?
02How critical is experience with TSV, Interposer, or Hybrid bond technologies for this Component and Quality Reliability Engineer role at Winbond?
03What is the typical career growth path for a Reliability Engineer at Winbond?
04What are the expectations regarding travel to the Zhubei plant for this role at Winbond?
05What level of English proficiency is required for the Component and Quality Reliability Engineer role at Winbond?
06How does Winbond approach managing abnormal product events (MRB) and process changes (PCRB) within the reliability engineering function?
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