ASIC Package Engineer

About Snap Inc.

Snap Inc. is a technology company believing the camera offers the greatest opportunity to improve how people live and communicate. Snap contributes to human progress by empowering self-expression, living in the moment, learning about the world, and fostering connection. The company's core products include Snapchat, a visual messaging app; Lens Studio, an augmented reality platform; and its AR glasses, Spectacles.

About the Spectacles Team

The Spectacles team is dedicated to pushing technological boundaries to bring people closer together in the real world. Our fifth-generation Spectacles, powered by Snap OS, demonstrate the potential of standalone, see-through AR glasses to enhance playing, learning, and working collaboratively.

The Role: ASIC Package Engineer

We are seeking an ASIC Package Engineer to join the Wearable Computing Silicon group at Snap Inc.!

What you'll do:

• Drive next-generation package design from concept through to production.
• Develop solutions ranging from classical FCCSPs to SiP and 3D-stacked packages and modules, adapting to specific product needs.
• Contribute to silicon floorplan, bump map, and TSV designs as part of a comprehensive product development team.
• Design ball maps, substrate, and interposers, while directly managing third-party packaging partners.
• Work closely with the New Product Introduction (NPI) team to define and qualify product requirements.
• Lead Snap's packaging efforts for custom silicon development from initial concept to mass production.
• Collaborate cross-functionally with design, engineering, and manufacturing teams on custom ASICs for wearable devices.
• Bridge custom silicon development and PCB integration, ensuring system constraints like routing and power delivery are considered.
• Define and prototype solutions (substrate, interposer, etc.) to guarantee high yield and manufacturability.
• Select packaging partners in conjunction with the Global Supply team.
• Monitor production, analyze manufacturing issues, and develop qualification plans according to industry standards with the NPI team.
• Identify and mitigate risks in the product introduction process, implementing necessary contingency plans.
• Serve as an integral part of a diverse, international team of skilled engineers and scientists, driving team growth.

Knowledge, Skills & Abilities:

• Extensive experience in designing complex packages (FC-CSP, SiP, etc.) and proficiency with associated tools.
• Strong understanding of signal integrity principles and proven experience interpreting Power Integrity and Signal Integrity simulations.
• Knowledge of package thermal simulations.
• Deep understanding of various packaging assembly steps.
• Successful track record in designing packages for high-volume shipped products.
• Proactive, flexible, team-oriented with a positive attitude and excellent problem analysis skills.
• Proven experience in process development and documentation.
• Excellent written and verbal English communication.

Minimum Qualifications:

• BSc or MSc degree in electrical engineering or a related field, or equivalent years of experience.
• 7+ years of experience in ASIC package development.
• 3+ years of experience in Power Integrity and Signal Integrity.
• Excellent Project Management skills.

Preferred Qualifications:

• Familiarity with semiconductor supply chain and logistics management.
• Experience with failure analysis techniques.
• Hands-on experience troubleshooting packaging yield issues at the factory.
• Experience with common requirement management practices and software engineering tools like Github.
• Mandarin language skills are a plus.
• A passion for Snapchat and creativity!

'Default Together' Policy at Snap:

At Snap Inc., we believe that in-person collaboration accelerates culture building, reinforces values, and enhances service to our community, customers, and partners. Our 'default together' approach requires team members to work in an office 4+ days per week.

Our Benefits:

Snap Inc. is its own community, supporting you and your loved ones with comprehensive benefits. These include paid parental leave, extensive medical coverage, emotional and mental health support programs, and compensation packages designed to share in Snap’s long-term success!

Key skills/competency

• ASIC packaging
• FC-CSP
• SiP design
• 3D-stacked packages
• Signal integrity
• Power integrity
• Thermal simulation
• New Product Introduction (NPI)
• Semiconductor supply chain
• Project management