Hardware Engineering Internship

Hardware Engineering Internship at Qualcomm

Qualcomm Technologies, Inc. is relentlessly innovating, transforming businesses, enriching lives, and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world, building on nearly 40 years of era-defining technology breakthroughs. We deliver leading-edge AI, high-performance, lower-power computing, and unrivaled connectivity. We're proud to be the partner of choice to many of the world’s largest enterprises, enabling next-generation digital transformation. At Qualcomm, we are engineering human progress.

Join Us in Shaping the Future

At Qualcomm, we're committed to engineering human progress by delivering intelligent computing everywhere. We're passionate about harnessing the power of technology to transform industries and improve lives. Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work. By joining our team, you'll be part of a community that's pushing the boundaries of what's possible in AI, computing, and connectivity. With a global footprint spanning over 30 countries, you'll have the chance to collaborate with diverse talent and contribute to projects that are shaping the future of technology.

Our early career programs are designed to attract inventive minds, offering a platform to contribute to our long-term innovation pipeline. You'll be part of a community that values collaboration, creativity, and continuous learning. Our programs provide real-world experience, technical skills, and professional development opportunities, empowering you to make a meaningful impact and achieve your career goals. Join us for our U.S. 2026 summer intern class!

Role Overview

As a Qualcomm Hardware Engineering Intern, you’ll have the opportunity to push the boundaries of what exists and help establish the new standards for tomorrow. You will leverage your electrical and/or computer engineering degree to work on one of the following Qualcomm multi-disciplinary teams: System (architecture, modeling, power, thermal, silicon profiling), Front-end Design (micro-architecture, modeling, RTL), Implementation (synthesis & timing constraints), Design-for-Test (DFT), Physical Design (place & route, CTS, timing closure), Pre-silicon Verification (DV), Emulation, Post-silicon Validation (VI), CAD, and GPU Design.

This Internship Supports Multiple Technical Tracks, Including:

• GPU Engineering
• CPU Engineering
• Digital Design / DV
• SoC Systems Engineering

Based on your resume, you may be aligned to one or more of these tracks. Please clearly indicate your track interest(s) in your resume, as this is the only way to communicate preferences during the recruiting process.

Minimum Qualifications

• Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field
• Must be available for 11–14 weeks during Summer 2026 (May–September)
• Expected graduation date of November 2026 or later
• 1+ years of academic experience with programming languages such as C, C++, Python, Perl, Verilog, SystemVerilog

Preferred Qualifications

• Candidates actively pursuing a degree with an anticipated graduation between November 2026 and June 2027
• Currently enrolled in a Master’s or PhD degree program in computer engineering, electrical engineering, or a related field

Track 1: GPU Engineering

• Engineering design and development in MSM SOC and chipset architecture
• ASIC implementation of image processing camera IP
• GPU pipeline validation (stimulus generators, checkers, monitors, drivers, models)
• Graphics power analysis & optimization (Vulkan)
• Familiarity with multimedia or communication technologies including audio/video codecs, camera, WLAN, LTE, and 5G
• Programming experience in C, Perl, Verilog, SystemVerilog, C++, Python

Track 2: CPU Engineering

• Validation of CPU and SOC-level micro-architecture concepts
• Development of test and coverage plans, verification methodology, and scalable environments
• Execution of verification plans including regression, debug, and bring-up
• Familiarity with simulators, coverage tools, waveform viewers
• Programming experience in C, C++, Python

Track 3: Digital Design / DV

• RTL development for modem physical and MAC layer processing
• Verification component development using SystemVerilog and UVM
• Modeling cellular modem datapaths for bit-exact correctness
• Knowledge of digital design, DSP, wireless communication, LTE, 5G, Wi-Fi
• Exposure to machine learning concepts as applied to digital signal processing or modem architecture is a plus
• Programming experience in C, Python, Perl, Verilog, SystemVerilog, C++, Matlab

Track 4: SoC Systems Engineering

• Concepts in computer architecture (CPU, GPU, DSP, interconnects, MMUs, etc.)
• System-level performance modeling and simulation
• Power and thermal management strategies
• Post-silicon validation and characterization
• Embedded software design, driver development for Linux/Windows
• OS principles and HW/SW interaction
• Experience supporting or optimizing machine learning workloads on embedded systems or accelerators
• Understanding of power/performance tradeoffs and system-level architecture
• Programming experience in C/C++, Python; scripting and profiling tools

Qualcomm’s Internship Program

Our interns join world-class teams to help define and build what is next for mobility and the world. You’ll be paired with a mentor with visibility to your project and team, receive support from your manager, and have access to the entire Qualcomm employee community to ensure your success. To round out your summer internship, we host professional development workshops, social events, cross-functional speaker sessions, and an executive speaker series. In addition to competitive hourly pay and accrued vacation time, you will receive relocation coverage and furnished housing accommodations for the duration of your internship.

Internship opportunities may be available in the following locations, depending on team and project needs: Austin, Boulder, Boxborough, Bridgewater, Chandler, Irvine, New York City, Louisville, Raleigh, San Diego, Santa Clara, and Seattle.

Application Process

By applying here, you are expressing interest in one of our many 2026 Qualcomm Hardware Engineering Internships. It is important to note that this is not a job posting for a specific role. We will review resumes on an ongoing basis, and a recruiter may reach out to you.

Key skills/competency

• CPU design
• GPU design
• SoC systems
• Digital Verification
• RTL development
• System architecture
• Power management
• Embedded systems
• Performance modeling
• Post-silicon validation