Hardware Engineering Internship - Summer 2026

Hardware Engineering Internship - Summer 2026

Qualcomm Technologies, Inc. is seeking inventive minds for a Hardware Engineering Internship for Summer 2026. This role is within the Interns Group, specifically for Interim Engineering Intern - HW.

About Qualcomm

Qualcomm relentlessly innovates, transforming businesses, enriching lives, and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world, building on nearly 40 years of era-defining technology breakthroughs. We deliver leading-edge AI, high-performance, lower-power computing, and unrivaled connectivity. We partner with many of the world’s largest enterprises and ecosystem partners to enable next-generation digital transformation. At Qualcomm, we are engineering human progress.

Join Us in Shaping the Future

We are committed to engineering human progress by delivering intelligent computing everywhere, passionate about harnessing technology's power to transform industries and improve lives. Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work. You'll be part of a community pushing the boundaries of what's possible in AI, computing, and connectivity, collaborating with diverse talent across a global footprint spanning over 30 countries to shape the future of technology.

These programs attract inventive minds, providing a platform to contribute to our long-term innovation pipeline. We value collaboration, creativity, and continuous learning, offering real-world experience, technical skills, and professional development to empower you to make a meaningful impact and achieve your career goals. Join us for our U.S. 2026 summer intern class!

Role Overview

As a Qualcomm Hardware Engineering Intern, you will have the opportunity to push the boundaries of what exists and help establish new standards for tomorrow. You will leverage your electrical and/or computer engineering degree to work on one of Qualcomm’s multi-disciplinary teams, including:

• System (architecture, modeling, power, thermal, silicon profiling)
• Front-end Design (micro-architecture, modeling, RTL)
• Implementation (synthesis & timing constraints)
• Design-for-Test (DFT)
• Physical Design (place & route, CTS, timing closure)
• Pre-silicon Verification (DV)
• Emulation
• Post-silicon Validation (VI)
• CAD
• GPU Design

This Internship Supports Multiple Technical Tracks, Including:

• GPU Engineering
• CPU Engineering
• Digital Design / DV
• SoC Systems Engineering

Based on your resume, you may be aligned to one or more of these tracks. Please clearly indicate your track interest(s) in your resume, as this is the only way to communicate preferences during the recruiting process.

Minimum Qualifications

• Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field.
• Must be available for 11–14 weeks during Summer 2026 (May–September).
• Expected graduation date of November 2026 or later.
• 1+ years of academic experience with programming languages such as C, C++, Python, Perl, Verilog, SystemVerilog.

Preferred Qualifications

• Candidates actively pursuing a degree with an anticipated graduation between November 2026 and June 2027.
• Currently enrolled in a Master’s or PhD degree program in computer engineering, electrical engineering, or a related field.

Track 1: GPU Engineering

• Engineering design and development in MSM SOC and chipset architecture.
• ASIC implementation of image processing camera IP.
• GPU pipeline validation (stimulus generators, checkers, monitors, drivers, models).
• Graphics power analysis & optimization (Vulkan).
• Familiarity with multimedia or communication technologies including audio/video codecs, camera, WLAN, LTE, and 5G.
• Programming experience in C, Perl, Verilog, SystemVerilog, C++, Python.

Track 2: CPU Engineering

• Validation of CPU and SOC-level micro-architecture concepts.
• Development of test and coverage plans, verification methodology, and scalable environments.
• Execution of verification plans including regression, debug, and bring-up.
• Familiarity with simulators, coverage tools, waveform viewers.
• Programming experience in C, C++, Python.

Track 3: Digital Design / DV

• RTL development for modem physical and MAC layer processing.
• Verification component development using SystemVerilog and UVM.
• Modeling cellular modem datapaths for bit-exact correctness.
• Knowledge of digital design, DSP, wireless communication, LTE, 5G, Wi-Fi.
• Exposure to machine learning concepts as applied to digital signal processing or modem architecture is a plus.
• Programming experience in C, Python, Perl, Verilog, SystemVerilog, C++, Matlab.

Track 4: SoC Systems Engineering

• Concepts in computer architecture (CPU, GPU, DSP, interconnects, MMUs, etc.).
• System-level performance modeling and simulation.
• Power and thermal management strategies.
• Post-silicon validation and characterization.
• Embedded software design, driver development for Linux/Windows.
• OS principles and HW/SW interaction.
• Experience supporting or optimizing machine learning workloads on embedded systems or accelerators.
• Understanding of power/performance tradeoffs and system-level architecture.
• Programming experience in C/C++, Python; scripting and profiling tools.

Qualcomm’s Internship Program

Our interns join world-class teams to help define and build what is next for mobility and the world. You’ll be paired with a mentor with visibility to your project and team, receive support from your manager, and have access to the entire Qualcomm employee community to ensure your success. To round out your summer internship, we host professional development workshops, social events, cross-functional speaker sessions, and an executive speaker series. In addition to competitive hourly pay and accrued vacation time, you will receive relocation coverage and furnished housing accommodations for the duration of your internship.

Internship opportunities may be available in the following locations, depending on team and project needs: Austin, Boulder, Boxborough, Bridgewater, Chandler, Irvine, New York City, Louisville, Raleigh, San Diego, Santa Clara, and Seattle.

Application Process

By applying here, you are expressing interest in one of our many 2026 Qualcomm Hardware Engineering internships. It is important to note that this is not a job posting for a specific role. We will review resumes on an ongoing basis, and a recruiter may reach out to you.

Export Control Notice

This role may require an export license for candidates with citizenship in certain countries (see current country list below – subject to change). Qualcomm, like other companies, is experiencing significant delays in the export license process. Please be advised that if an export license is required, you may not be able to start work with Qualcomm until the license is granted, which may impact your ability to participate in the internship.

Countries requiring export: Armenia, Azerbaijan, Belarus, Burma (Myanmar), Cambodia, China, Cuba, Georgia, Hong Kong, Iran, Iraq, Kazakhstan, Kyrgyzstan, Laos, Libya, Macau, Moldova, Mongolia, Nicaragua, North Korea, Russia, Sudan, Syria, Tajikistan, Turkmenistan, Ukraine, Uzbekistan, Venezuela, Vietnam, and Yemen.

EEO Employer

Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Pay Range And Other Compensation & Benefits

The pay range for this role is $15.30 - $98.00 per hour. Salary is only one component of total compensation at Qualcomm, which also includes a competitive annual discretionary bonus program and opportunity for annual RSU grants. A highly competitive benefits package is designed to support your success. Your recruiter will discuss all that Qualcomm has to offer.

Key skills/competency

• Hardware Design
• CPU Architecture
• GPU Architecture
• SoC Systems
• Digital Verification
• RTL Development
• SystemVerilog
• UVM
• Power Optimization
• Performance Modeling