Hardware Engineering Internship – Summer 2026

About Qualcomm

Qualcomm Technologies, Inc. is at the forefront of innovation, transforming businesses and enriching lives by fortifying societies through intelligent computing everywhere. With nearly 40 years of pioneering technology breakthroughs, Qualcomm delivers leading-edge AI, high-performance, lower-power computing, and unrivaled connectivity. They are a partner of choice for many of the world's largest enterprises, enabling next-generation digital transformation alongside ecosystem partners. At Qualcomm, human progress is engineered.

Join Qualcomm's early career programs to contribute to shaping the future of technology. These programs offer limitless opportunities for growth, mentorship, and meaningful work within a community pushing the boundaries in AI, computing, and connectivity. With a global presence across 30+ countries, you'll collaborate with diverse talent on projects that shape the future. The programs attract inventive minds, contributing to Qualcomm's long-term innovation pipeline, providing real-world experience, technical skills, and professional development. Join the U.S. 2026 summer intern class to make a meaningful impact and achieve your career goals.

Role Overview: Hardware Engineering Internship – Summer 2026

As a Qualcomm Hardware Engineering Intern, you will have the opportunity to push existing boundaries and establish new standards for tomorrow. Leveraging your electrical and/or computer engineering degree, you will work on one of Qualcomm's multi-disciplinary teams. These teams include: System (architecture, modeling, power, thermal, silicon profiling), Front-end Design (micro-architecture, modeling, RTL), Implementation (synthesis & timing constraints), Design-for-Test (DFT), Physical Design (place & route, CTS, timing closure), Pre-silicon Verification (DV), Emulation, Post-silicon Validation (VI), CAD, and GPU Design.

Internship Tracks

This internship supports multiple technical tracks, and your resume may align you with one or more of these. Please indicate your track interest(s) in your resume, as this is the primary way to communicate preferences during the recruiting process.

• GPU Engineering: Involves engineering design and development in MSM SOC and chipset architecture, ASIC implementation of image processing camera IP, GPU pipeline validation (stimulus generators, checkers, monitors, drivers, models), and graphics power analysis & optimization (Vulkan). Familiarity with multimedia or communication technologies including audio/video codecs, camera, WLAN, LTE, and 5G is beneficial.
• CPU Engineering: Focuses on validation of CPU and SOC-level micro-architecture concepts, development of test and coverage plans, verification methodology, and scalable environments. Responsibilities include execution of verification plans like regression, debug, and bring-up. Familiarity with simulators, coverage tools, and waveform viewers is expected.
• Digital Design / DV: Encompasses RTL development for modem physical and MAC layer processing, verification component development using SystemVerilog and UVM, and modeling cellular modem datapaths for bit-exact correctness. Knowledge of digital design, DSP, wireless communication, LTE, 5G, Wi-Fi is important, with exposure to machine learning concepts for digital signal processing or modem architecture being a plus.
• SoC Systems Engineering: Deals with concepts in computer architecture (CPU, GPU, DSP, interconnects, MMUs, etc.), system-level performance modeling and simulation, power and thermal management strategies, post-silicon validation and characterization, and embedded software design/driver development for Linux/Windows. Understanding OS principles, HW/SW interaction, supporting/optimizing machine learning workloads on embedded systems or accelerators, and power/performance tradeoffs are key.

Minimum Qualifications

• Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field.
• Must be available for 11–14 weeks during Summer 2026 (May–September).
• Expected graduation date of November 2026 or later.
• 1+ years of academic experience with programming languages such as C, C++, Python, Perl, Verilog, SystemVerilog.

Preferred Qualifications

• Actively pursuing a degree with an anticipated graduation between November 2026 and June 2027.
• Currently enrolled in a Master’s or PhD degree program in computer engineering, electrical engineering, or a related field.

Qualcomm’s Internship Program Benefits

Qualcomm interns join world-class teams to define and build the future of mobility. You’ll be paired with a mentor, receive manager support, and have access to the entire Qualcomm employee community. The program includes professional development workshops, social events, cross-functional speaker sessions, and an executive speaker series. In addition to competitive hourly pay and accrued vacation, interns receive relocation coverage and furnished housing accommodations for the duration of the internship.

Key skills/competency

• Hardware Design
• CPU Architecture
• GPU Architecture
• SoC Systems
• Digital Verification
• RTL Development
• SystemVerilog
• UVM
• C/C++/Python
• Power Optimization