Undergrad Thermal Engineering Intern

Undergrad Thermal Engineering Intern at Oracle

Must be enrolled in a Bachelor’s Degree program prior to and post internship. Target Internship Duration: May-Aug 2026 or June-Sept 2026. Location: this position is fully in office, in Burlington, MA. Visa sponsorship is not available for this role.

The Oracle Hardware Development (OHD) organization in Burlington, MA is looking for a Thermal Mechanical intern to work with our mechanical and thermal design team to support all phases of our development life-cycle, including design, simulation, documentation, and testing/validating prototype thermal designs and measuring airflow in our HW lab.

The Company: Oracle

Oracle is the world’s leading provider of business software. With a presence in over 175 countries, we are one of the biggest technology companies on the planet. We're using innovative emerging technologies to tackle real-world problems today. From advancing energy efficiency to reimagining online commerce, the work we do is not only transforming the world of business—it's helping advance governments, power nonprofits, and giving billions of people the tools they need to outpace change. For more information about Oracle (NYSE:ORCL), visit us at oracle.com.

Responsibilities - What You’ll Do:

We are seeking elite students with the expertise and passion for solving challenging unique problems. You will use your knowledge and creativity to design and build innovative new systems from the ground up. You will be working on new and challenging thermal and mechanical designs, handle mechanical and thermal models, performing thermal and airflow simulations and testing new thermal solutions in our labs. You will have the opportunity to work on cutting-edge technologies to tackle real-world problems in a collaborative, agile environment.

Qualifications - What You’ll Bring: (Objective Minimum Qualifications)

To be considered for an Undergrad Thermal Engineering Intern position in the OCI organization, you must possess the Objective Minimum Qualifications (OMQs) below. Please ensure that your application clearly indicates that you meet these OMQs, either on your resume and/or by uploading additional documents such as a transcript.

• Currently enrolled in a Bachelor’s degree in Mechanical Engineering, Thermal Engineering or an equivalent science/engineering field. Must be returning to the degree program after completion of the internship.
• Reside in the United States and/or attend a university in the US.
• Able to obtain work authorization in the US in 2026.
• Have academic coursework, completed projects, prior internship and/or research experience or equivalent in at least three of the following areas: Mechanical Engineering, Thermodynamics, Fluid Mechanics, Heat Transfer, Materials Science, Control System, Mechanical Design, Systems Engineering.
• Have proven experience (internships, projects, coursework) working on at least two of the following areas: Industry Standard MCAD tools, Digital thermometers, Pressure Gauges, PCB Design, Computational Fluid Dynamics (CFD) Modeling, Electronic Packaging.

Other Preferred Qualifications:

• Experience with CREO and FlowTherm
• Minimum Cumulative GPA of 3.0 or higher

What We'll Give You:

• High-impact projects: You’ll get the opportunity to directly influence our cutting-edge products. Your curiosity could help advance our next-generation cloud applications and help us find new ways to apply emerging technologies like AI, machine learning, and blockchain.
• Mentors that care: Work with industry-leading professionals and award-winning engineers. You’ll be assigned a project supervisor, a peer mentor, and intern buddies for 360-degree support.
• World-class training: Grow from once-in-a-lifetime learning opportunities and exposure to the latest technologies. You’ll benefit from comprehensive on-boarding, job-specific training, and leadership training.
• A fun-filled summer: Enjoy a close-knit, community experience alongside your class of fellow summer interns, with weekly events like tech talks, networking, volunteering, and social happenings.

Key skills/competency

• Thermal Analysis
• Mechanical Design
• CFD Modeling
• Heat Transfer
• Fluid Dynamics
• CAD Software
• Prototyping
• Systems Engineering
• Electronic Packaging
• Thermodynamics