Technical Program Manager II

About the Role

North Star Staffing is seeking a Technical Program Manager II to join a high-impact hardware team focused on developing next-generation AR wearable devices. This pivotal role involves driving flexible and rigid PCB development, integrating electrical components, and overseeing end-to-end program execution with global manufacturing partners.

The ideal Technical Program Manager II will possess strong expertise in PCB fabrication, flex circuits, multi-layer boards (MLBs), and APAC contract manufacturer management. The ability to thrive in fast-paced, high-ambiguity environments is crucial for success.

Key Responsibilities

• Hardware Program Ownership: Drive end-to-end ownership of flex and rigid PCB design releases from early development through production. Manage schematics, layout reviews, form development, vendor approval, and fabrication readiness. Track milestones, schedules, and risks across hardware development cycles.
• Manufacturing & Vendor Management: Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test & Pack) builds. Optimize schedule, yield, quality, and cost across manufacturing phases. Engage directly with APAC contract manufacturers and flex vendors, ensuring supplier readiness and managing vendor performance.
• Cross-Functional Collaboration: Partner closely with Electrical Engineering and cross-functional hardware teams. Gather design feedback and drive issue resolution. Communicate program status, risks, and mitigation plans to stakeholders. Support global collaboration across time zones, specifically coordinating with APAC teams.

Required Qualifications

• Minimum 5+ years of experience in electrical design, PCB development, or hardware engineering program management.
• Direct ownership of flex and multi-layer board (MLB) releases from concept to production.
• Experience managing SMT and FATP builds end-to-end.
• Hands-on APAC Contract Manufacturer (CM) management.
• Experience engaging flex vendors and ensuring supplier readiness.
• Strong risk management, schedule tracking, and cross-functional coordination skills.

Preferred Qualifications

• Experience developing AR wearable devices or compact consumer electronics.
• Experience integrating small electrical components in constrained form factors.
• Knowledge of advanced PCB fabrication processes and materials.
• Degree in Electrical Engineering or a related technical discipline.

Key skills/competency

• Technical Program Management
• PCB Fabrication
• Flex Circuits
• Multi-Layer Boards (MLBs)
• AR Wearables
• SMT & FATP
• APAC Vendor Management
• Electrical Component Integration
• Risk Management
• Hardware Engineering