Technical Program Manager II

About the Role

We are seeking a Technical Program Manager II to support a high-impact hardware team developing next-generation AR wearable devices. This role focuses on flexible and rigid PCB development, electrical component integration, and end-to-end program execution across global manufacturing partners. The ideal candidate has strong experience in PCB fabrication, flex circuits, MLBs (multi-layer boards), and APAC contract manufacturer management, along with the ability to operate in fast-paced, high-ambiguity environments.

Key Responsibilities

Hardware Program Ownership

• Drive end-to-end ownership of flex and rigid PCB design releases from early development through production
• Manage schematics, layout reviews, form development, vendor approval, and fabrication readiness
• Track milestones, schedules, and risks across hardware development cycles

Manufacturing & Vendor Management

• Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test & Pack) builds
• Optimize schedule, yield, quality, and cost across manufacturing phases
• Engage directly with APAC contract manufacturers and flex vendors
• Ensure supplier readiness and manage vendor performance

Cross-Functional Collaboration

• Partner with Electrical Engineering and cross-functional hardware teams
• Gather design feedback and drive issue resolution
• Communicate program status, risks, and mitigation plans to stakeholders
• Support global collaboration across time zones (including APAC coordination)

Required Qualifications

• Minimum 5+ years of experience in electrical design, PCB development, or hardware engineering program management
• Direct ownership of flex and multi-layer board (MLB) releases from concept to production
• Experience managing SMT and FATP builds end-to-end
• Hands-on APAC Contract Manufacturer (CM) management
• Experience engaging flex vendors and ensuring supplier readiness
• Strong risk management, schedule tracking, and cross-functional coordination skills

Preferred Qualifications

• Experience developing AR wearable devices or compact consumer electronics
• Experience integrating small electrical components in constrained form factors
• Knowledge of advanced PCB fabrication processes and materials
• Degree in Electrical Engineering or related technical discipline

Key skills/competency

• PCB Fabrication
• Flex Circuits
• Multi-Layer Boards (MLBs)
• AR Wearables Hardware
• SMT Build Management
• FATP Build Management
• APAC Vendor Management
• Electrical Component Integration
• Hardware Program Management
• Risk Mitigation