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Astera Labs

Technical Lead Package Platform Engineer

Astera Labs · San Jose, California, United States

Posted 26 days ago · $160,000 to $200,000

or apply directly on Astera Labs's site. We never take the application ourselves.

Is this posting real?

This role has been open
26 days
Astera Labs's roles stay open a median of 45 days
Reposted
No
Salary listed
Yes
43% of Astera Labs's roles list one
Ghost-job risk at Astera Labs
high
116 stale, 8 reposted of 160 open
Hiring momentum
218 roles opened in the last 90 days
↑ up vs. the prior 90 days
Last confirmed on the employer's board
2026-09-17

Measured from postings appearing on and disappearing from Astera Labs's own greenhouse board since 2026-08-03. Full hiring picture for Astera Labs.

About this role

The Technical Lead Package Platform Engineer will oversee the development, qualification, and manufacturing of advanced FCBGA packages. This role involves leading NPI development, managing supplier relationships, and addressing customer quality issues while collaborating with various internal teams to ensure successful product launches.

Our read on this posting3.8out of 5
benefits
1/5
freshness
4/5
career value
4/5
role clarity
5/5
pay transparency
5/5

Scored from the posting itself — how clearly the role is described, how much it says about pay and benefits, and how recently it was listed. Not a judgement of Astera Labs as an employer.

What you need

  • Bachelor's degree or higher in a related field
  • Minimum of 5 years of professional experience in electronic packaging fields
  • Strong experience in FCBGA assembly manufacturing processes and laminate substrate technologies
  • Proven NPI development experience for advanced flip-chip packages, from early package definition through qualification and production release
  • Experience with package implementation from die netlist to flip-chip package design and manufacturing
  • Demonstrated experience managing substrate suppliers and assembly OSAT partners

Nice to have

  • Experience with Cadence Allegro Package Designer (APD) or equivalent package design tools
  • Strong knowledge of FCBGA package reliability mechanisms, test methodologies, and qualification requirements
  • Experience developing and executing qualification plans for FCBGA packages
  • Experience with system-level reliability assessment of large-body FCBGA packages
  • Subject-matter expertise in Co-Packaged Optics (CPO) and/or Near-Packaged Optics (NPO)

What you get

  • Base salary range is $160,000 to $200,000 depending on experience, level, and business need
  • This role may be eligible for discretionary bonus, incentives and benefits

Worth weighing

  • No specific mention of remote work options
  • The role requires strong collaboration across multiple teams and external partners, which may imply a dynamic work environment
  • The salary range is broad, indicating potential variability based on negotiation or experience
  • Focus on advanced packaging technologies may require continuous learning and adaptation to new methods

Summarised from Astera Labs's posting. Read the full original.

Listed by Astera Labs on their greenhouse job board, last confirmed open on 2026-09-17. PitchMeAI is not the employer.

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