Sr. Engineer, Package Design
Tenstorrent · United States
- Hybrid
- Full-time
- $300,000 / year
- United States
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Sr. Engineer, Package Design
Tenstorrent · United States
Jamie Fox
Hiring Manager · h•••••@job-boards.greenhouse.io
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Not recommended alone — most applicants never hear back.
Job highlights
- Design advanced semiconductor package routing studies.
- Collaborate on early-stage package/board co-design.
- Work with SI/PI, mechanical, and system teams.
- Analyze routing congestion and signal escape strategies.
- Enhance engineering workflows with AI techniques.
About the role
About Tenstorrent
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.About the Role
We are seeking a designer to create board-level routing studies, design mock-ups, and SI/PI modeling collateral that support advanced semiconductor package development. This role is focused on early-stage package/board co-design rather than production PCB release. The designer will work closely with signal integrity, power integrity, mechanical, and system teams to develop representative PCB routing environments for BGA optimization, package escape studies, and system-level electrical modeling.Location
This role is hybrid, based out of Santa Clara, California, Austin, Texas, Toronto Canada or New Taipei City, Taiwan.Experience Levels
We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.Who You Are
- An experienced PCB designer looking to expand into advanced semiconductor packaging and package-board co-design.
- Comfortable working in ambiguous problem spaces and using engineering judgment to evaluate multiple implementation tradeoffs.
- Interested in understanding how package architecture, BGA design, and board implementation influence overall system performance.
- Motivated by solving complex routing, connectivity, and electrical design challenges.
- Excited to apply automation, data analytics, and emerging AI techniques to improve engineering workflows.
What We Need
- 3+ Years experience with Cadence Allegro PCB Designer.
- Experience with high-pin-count BGAs and complex connectivity requirements.
- Ability to analyze routing congestion, layer utilization, and signal escape strategies.
- Working knowledge of Signal and Power Integrity principles.
- Strong communication skills and the ability to collaborate across multiple engineering disciplines.
What You Will Learn
- How to effectively drive co-design across silicon, packages, and systems.
- Advanced packaging concepts including chiplets, 2.5D Packaging, and On/Off-Package Memory.
- Power delivery architectures ranging from traditional lateral solutions to emerging vertical power delivery approaches, including backside power delivery, integrated voltage regulators, and package embedded passives.
Compensation and Benefits
Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made. Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.Export Control Notice
This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.Key skills/competency
- PCB Design
- Semiconductor Packaging
- Signal Integrity
- Power Integrity
- Cadence Allegro
- BGA Design
- Routing Studies
- Co-design
- Electrical Modeling
- AI Engineering Workflows
Skills & topics
- PCB Design
- Package Design
- Signal Integrity
- Power Integrity
- Cadence Allegro
- BGA Design
- Routing
- Co-design
- Semiconductor
- AI
- Engineer
- Senior Engineer
How to get hired
- Tailor your resume: Highlight Cadence Allegro experience and package-board co-design skills relevant to AI technology.
- Showcase collaboration: Emphasize your ability to work with SI/PI, mechanical, and system teams.
- Demonstrate problem-solving: Detail complex routing, BGA optimization, and electrical modeling challenges you've overcome.
- Prepare for technical questions: Be ready to discuss Signal and Power Integrity principles and your experience with high-pin-count BGAs.
- Express AI interest: Articulate how you'd apply automation and AI to engineering workflows.
Technical preparation
Master Cadence Allegro PCB Designer.,Practice BGA optimization and routing studies.,Review SI/PI principles and applications.,Familiarize with chiplet and 2.5D packaging.
Behavioral questions
Describe a complex design challenge you solved.,How do you handle ambiguous problem spaces?,How do you collaborate with cross-functional teams?,How have you improved engineering workflows?
Prefer to apply the usual way?
Not recommended alone — most applicants never hear back. Email the hiring manager first.
Frequently asked questions
- What is the salary range for a Senior Engineer, Package Design at Tenstorrent?
- The compensation for engineers at Tenstorrent ranges from $100,000 to $500,000 annually, including base and variable compensation targets. The final offer will depend on experience, skills, education, background, and location.
- Does Tenstorrent offer benefits to its employees?
- Yes, Tenstorrent offers a highly competitive compensation package and benefits. Specific details about the benefits package would typically be discussed during the interview process.
- What is the work arrangement for the Senior Engineer, Package Design role?
- This is a hybrid role, allowing for a mix of on-site and remote work. Specifics on the hybrid model would likely be determined by the team and location.
- What are the primary technical skills required for this role?
- Key technical skills include at least 3 years of experience with Cadence Allegro PCB Designer, experience with high-pin-count BGAs, ability to analyze routing congestion, and a working knowledge of Signal and Power Integrity principles.
- What kind of career growth opportunities are available at Tenstorrent for this role?
- This role offers the opportunity to learn advanced packaging concepts, drive co-design across silicon, packages, and systems, and explore innovative power delivery architectures. The company also welcomes contributors of all seniorities, suggesting potential for growth.
- How does Tenstorrent approach interviewing for this position?
- Tenstorrent assesses candidates for the appropriate experience level during the interview process. Offers will align with the determined level, which may differ from the initial posting. Candidates should be prepared for technical and behavioral evaluations.
- Are there any specific requirements related to U.S. export laws for this position?
- Yes, this offer of employment may be contingent upon your eligibility to access U.S. export-controlled technology. This is due to U.S. export laws, and may affect the offer based on citizenship/permanent residency status or the ability to obtain necessary license approvals.
- What is the significance of package-board co-design in this role?
- Package-board co-design is central to this role, focusing on early-stage development to optimize BGA, support package escape studies, and enable system-level electrical modeling, rather than just production PCB release.
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