Senior Engineer II, Process Engineering (tALD)
ASM · South Korea > Hwaseong
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- South Korea > Hwaseong
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Subject: Interested in the Senior Engineer II, Process Engineering (tALD) role at ASM
Hi Casey — I came across the Senior Engineer II, Process Engineering (tALD) opening and wanted to reach out directly. I've spent the last few years doing exactly this kind of work, and ASM stood out because…
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About the role
Step into a career with ASM, where cutting edge technology meets collaborative culture.
For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.
Job's mission
As a Senior Engineer II, Process Engineering (tALD) at ASM, you will lead advanced process development focused on thermal Atomic Layer Deposition (tALD) technologies to enable next-generation semiconductor devices. In this role, you will be responsible for developing, optimizing, and transferring high-performance thin film processes, while collaborating closely with customers and cross-functional teams to deliver differentiated solutions aligned with advanced technology nodes.
What you will be working on
- Lead development and optimization of thermal ALD (tALD) processes for metal and dielectric thin films targeting advanced semiconductor applications
- Design and execute complex experiments using Design of Experiments (DOE) and advanced statistical methodologies to optimize process performance and window
- Develop and qualify new precursor chemistries, reaction mechanisms, and deposition conditions for tALD processes
- Analyze and interpret material and film properties using advanced characterization techniques (e.g., SEM, TEM, XPS, SIMS, ellipsometry)
- Drive process integration of tALD films into FEOL/BEOL device architectures and customer flows
- Identify and resolve process and equipment issues through hands-on troubleshooting and root cause analysis
- Collaborate with hardware engineering teams to define tool requirements and improve reactor performance specific to tALD applications
- Work closely with customers, account teams, and global R&D to align process development with technology roadmaps and application requirements
- Support technology transfer by delivering customer demonstrations, technical documentation, and training to field teams
- Contribute to technical publications and intellectual property (IP) generation in tALD process and materials development
- Stay updated on state-of-the-art ALD/tALD technologies and proactively introduce innovative ideas into development programs
What we are looking for
- PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a related discipline, or MS with 5–8+ years of relevant semiconductor industry experience, with strong hands-on experience in Atomic Layer Deposition (ALD) and a clear focus on tALD process development
- Deep understanding of tALD surface reactions, precursor chemistry, and film growth mechanisms, along with proven experience in thin film deposition process development and optimization
- Strong knowledge of metal and dielectric film deposition and integration, including hands-on experience with DOE, data analysis, and process characterization techniques
- Ability to independently lead complex process development activities from concept through transfer, with experience working in semiconductor cleanroom environments
- Strong communication skills in English (Korean preferred), with the ability to clearly articulate complex technical concepts and collaborate effectively with cross-functional teams
What sets you apart
- Experience integrating tALD-based films into advanced logic, memory, or 3D device architectures
- Hands-on experience with selective ALD / Area Selective Deposition (ASD)
- Experience in precursor evaluation and development for thermal ALD processes
- Familiarity with scaling challenges for high aspect ratio (HAR) structures
- Prior experience supporting customer engagement, demonstrations, and process transfer
Apply today to be part of what’s next.
We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.
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