Head of Product Development Engineering
Ethernovia, Inc. · San Jose, CA
Posted about a month ago · $220,000 - $280,000
or apply directly on Ethernovia, Inc.'s site. We never take the application ourselves.
Is this posting real?
- This role has been open
- 30 days Ethernovia, Inc.'s roles stay open a median of 45 days
- Reposted
- No
- Salary listed
- Yes 33% of Ethernovia, Inc.'s roles list one
- Ghost-job risk at Ethernovia, Inc.
- high 22 stale, 0 reposted of 27 open
- Hiring momentum
- 33 roles opened in the last 90 days ↑ up vs. the prior 90 days
- Last confirmed on the employer's board
- 2026-09-17
Measured from postings appearing on and disappearing from Ethernovia, Inc.'s own greenhouse board since 2026-08-03. Full hiring picture for Ethernovia, Inc..
About this role
The Head of Product Development Engineering at Ethernovia will lead the transition of products from new product introduction (NPI) to high-volume manufacturing (HVM). This role involves hands-on management of semiconductor product development, ensuring the integration of networking chip designs with automotive-grade silicon manufacturing. Responsibilities include overseeing product testing, manufacturing flows, yield improvement, and collaboration across various engineering teams.
- benefits
- 3/5
- freshness
- 4/5
- career value
- 4/5
- role clarity
- 4/5
- pay transparency
- 5/5
Scored from the posting itself — how clearly the role is described, how much it says about pay and benefits, and how recently it was listed. Not a judgement of Ethernovia, Inc. as an employer.
What you need
- Bachelor's or Master's degree in Electrical Engineering or a related technical field
- 12+ years of experience in fabless semiconductor operations for complex, high-performance SOCs or networking ICs
- Direct experience with ATE and SLT testing, characterization, productization and silicon/package qualification
- Experience working with foundries, assembly houses, test houses, and OSATs in high-volume product development
- Expertise with iJTAG, Scan, MBIST, Sensor, SerDes, LSIO/HSIO testing on ATE
- Experience productizing high-speed communications chips using ATE and system characterization
Nice to have
- Familiarity with FinFET process node and QFN, LGA/BGA assembly process for automotive products
- Experience delivering high speed SerDes products to Tier-1 automotive OEMs
- Experience managing contractors and leadership experience
What you get
- Pre IPO stock options
- Cutting edge technology
- World class team
- Competitive base salary
- Flexible hours
- Medical, dental and vision insurance for employees
Worth weighing
- No specific mention of remote work options, though the role is listed as hybrid
- Salary range provided is broad, which may indicate flexibility or uncertainty in compensation
- The role requires extensive experience, which may limit applicants who are not highly qualified
Summarised from Ethernovia, Inc.'s posting. Read the full original.
Listed by Ethernovia, Inc. on their greenhouse job board, last confirmed open on 2026-09-17. PitchMeAI is not the employer.
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