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ASM

Senior Engineer, Process Engineering (Advanced Packaging)

ASM · Taiwan > Kaohsiung

Posted 21 days ago

or apply directly on ASM's site. We never take the application ourselves.

Is this posting real?

This role has been open
21 days
ASM's roles stay open a median of 45 days
Reposted
No
Salary listed
No
0% of ASM's roles list one
Ghost-job risk at ASM
low
0 stale, 3 reposted of 450 open
Hiring momentum
553 roles opened in the last 90 days
↑ up vs. the prior 90 days
Last confirmed on the employer's board
2026-09-17

Measured from postings appearing on and disappearing from ASM's own greenhouse board since 2026-08-03. Full hiring picture for ASM.

About this role

In this role as a Senior Engineer in Process Engineering, you will focus on the development and qualification of advanced thin film deposition solutions for semiconductor packaging. Your day-to-day responsibilities will include leading hardware and process qualifications, optimizing processes, executing customer demonstrations, and collaborating with various teams to enhance product offerings based on customer needs. This position also involves significant customer interaction and travel across Asia.

Our read on this posting2.6out of 5
benefits
1/5
freshness
4/5
career value
4/5
role clarity
4/5
pay transparency
0/5

Scored from the posting itself — how clearly the role is described, how much it says about pay and benefits, and how recently it was listed. Not a judgement of ASM as an employer.

What you need

  • Master’s degree or above in Materials Science, Physics, Chemical Engineering, or a related field
  • 7-10+ years of experience in thin film deposition equipment development, process engineering, or semiconductor manufacturing
  • Experience supporting customer qualifications, process development, production ramp, demonstrations, and field issue resolution
  • Strong understanding of semiconductor packaging technology and customer-driven process development
  • Proven ability to independently lead complex process development projects, including project planning, experimental design, and stakeholder management
  • Excellent communication and presentation skills, with the ability to communicate complex technical concepts clearly and effectively

Nice to have

  • Strong customer-facing experience with a track record of driving technology adoption and customer penetration
  • Deep expertise in thin film deposition processes and semiconductor packaging applications
  • Ability to translate customer challenges into actionable R&D, product improvement, and business opportunities
  • Comfortable working in a highly international environment with frequent customer interaction
  • Exceptional verbal and written communication in both English and Mandarin, with the ability to convey complex technical concepts clearly and concisely

Worth weighing

  • Flexible work location options based on business needs
  • Potential relocation to the United States after 1-2 years for global career development
  • Role involves significant travel, approximately 30% of the time
  • High level of customer interaction may require strong interpersonal skills

Summarised from ASM's posting. Read the full original.

Listed by ASM on their greenhouse job board, last confirmed open on 2026-09-17. PitchMeAI is not the employer.

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