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ASM

Principal / Senior Engineer, Process Engineering (Advanced Packaging)

ASM · Singapore

Posted 28 days ago

or apply directly on ASM's site. We never take the application ourselves.

Is this posting real?

This role has been open
28 days
ASM's roles stay open a median of 45 days
Reposted
No
Salary listed
No
0% of ASM's roles list one
Ghost-job risk at ASM
low
0 stale, 3 reposted of 450 open
Hiring momentum
553 roles opened in the last 90 days
↑ up vs. the prior 90 days
Last confirmed on the employer's board
2026-09-17

Measured from postings appearing on and disappearing from ASM's own greenhouse board since 2026-08-03. Full hiring picture for ASM.

About this role

In this role as a Principal/Senior Process Engineer at ASM, you will focus on advancing semiconductor process technologies, particularly in Advanced Packaging. Your responsibilities will include researching and optimizing semiconductor processes, conducting complex experiments, and mentoring other engineers. You will also collaborate with customers and marketing teams, troubleshoot equipment issues, and contribute to technical documentation and presentations.

Our read on this posting2.8out of 5
benefits
1/5
freshness
4/5
career value
5/5
role clarity
4/5
pay transparency
0/5

Scored from the posting itself — how clearly the role is described, how much it says about pay and benefits, and how recently it was listed. Not a judgement of ASM as an employer.

What you need

  • Bachelor's, Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics
  • Direct experience working on D2W/W2W Hybrid bonding including surface preparation steps
  • Minimum 10 years of combined education, research, and work experience in thin-film deposition (ALD, CVD, PECVD) and advanced packaging processes
  • Proficiency in materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry)
  • Knowledge of electrical characterization techniques for CMOS devices
  • Ability to manage complex process development projects, including schedules, budgets, and personnel.

Nice to have

  • Expertise in integration advanced packaging process flows like CoWoS, SoIC, InFO
  • Experience in contributing Process and equipment qualification data towards a full Semiconductor equipment PLC process
  • Experience with advanced metrology/Inspection characterization techniques
  • Strong communication skills to convey technical concepts clearly.

Worth weighing

  • No salary listed
  • Role involves significant hands-on troubleshooting and customer engagement
  • Travel required up to 10%
  • Mentorship responsibilities may add to workload

Summarised from ASM's posting. Read the full original.

Listed by ASM on their greenhouse job board, last confirmed open on 2026-09-17. PitchMeAI is not the employer.

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